Simulation Analysis and Verification on Three-Dimensional Temperature Field of Strain Clamps for Overhead Lines

In order to study the temperature distribution of the strain clamps of overhead lines under different conditions, the finite element model based on the simplified structure of the strain clamp was build, and under the conditions of 600 A power frequency alternating current and different contact resistance ratios, the electromagnetic-thermal coupling finite element simulation analysis of the strain clamp was carried out, and the three-dimensional temperature field distribution of the strain clamp was finally obtained. The simulation results show that under normal conditions, the temperature of the conductive plate of the strain clamp is the lowest. When the contact resistance at different parts of the clamp increases, the increase of contact resistance at the conductive plate has the greatest effect on the overall temperature rise of the clamp, whereas the increase of the contact resistance at the crimp connection of the clamp body has the least effect. Meanwhile the temperature of the clamp will also limit the current carrying capacity of overhead lines. Finally the accuracy of the simulation was verified through the clamp resistance test and temperature rise test, and the error is about 2.3%.