Simulation Analysis and Verification on Three-Dimensional Temperature Field of Strain Clamps for Overhead Lines
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摘要: 为研究不同条件下架空线路耐张线夹温度分布情况，构建了基于耐张线夹简化结构的有限元模型，并在600 A工频交流电流和不同接触电阻比的条件下，进行了耐张线夹电磁-热耦合有限元仿真，最终得到耐张线夹的三维温度场分布. 仿真结果显示：在正常情况下，耐张线夹引流板处的温度最低；在线夹不同部位接触电阻增大的情况下，引流板处接触电阻的增大对线夹整体温度升高的影响最大，而线夹本体压接处接触电阻的增大对线夹温升影响最小，同时线夹温度升高也会制约架空线路导线载流量. 最后通过线夹电阻测量试验和温升试验验证仿真的准确性，误差约为2.3%.Abstract: In order to study the temperature distribution of the strain clamps of overhead lines under different conditions, the finite element model based on the simplified structure of the strain clamp was build, and under the conditions of 600 A power frequency alternating current and different contact resistance ratios, the electromagnetic-thermal coupling finite element simulation analysis of the strain clamp was carried out, and the three-dimensional temperature field distribution of the strain clamp was finally obtained. The simulation results show that under normal conditions, the temperature of the conductive plate of the strain clamp is the lowest. When the contact resistance at different parts of the clamp increases, the increase of contact resistance at the conductive plate has the greatest effect on the overall temperature rise of the clamp, whereas the increase of the contact resistance at the crimp connection of the clamp body has the least effect. Meanwhile the temperature of the clamp will also limit the current carrying capacity of overhead lines. Finally the accuracy of the simulation was verified through the clamp resistance test and temperature rise test, and the error is about 2.3%.
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图 1 NY300/40型线夹简化模型结构
Figure 1. Simplified model structure for the NY300/40 strain clamp
图 2 电磁-热耦合模型求解迭代流程
Figure 2. Iteration process for electromagnetic-thermal coupling model
图 3 所有接触面积比为1 000时温度分布
Figure 3. Temperature distribution with the contact area ratio of 1 000
图 4 线夹本体压接处接触面积比为100 000时温度分布
Figure 4. Temperature distribution when the contact area ratio of crimp connection at the clamp body is 100 000
图 5 引流板接触面积比为100 000时温度分布
Figure 5. Temperature distribution when the contact area ratio of the conductive plate is 100 000
图 6 引流板压接处接触面积比为100 000时温度分布
Figure 6. Temperature distribution when the contact area ratio of crimp connection at the conductive plate is 100 000
图 9 引流板接触面积比为5 000，压接部位接触面积比为1 000时的温度分布
Figure 9. Temperature distribution when the contact area ratio of the conductive plate is 5 000 and the contact area ratio of crimp connection is 1 000
表 1 不同部位接触情况恶化下耐张线夹的最高温度
Table 1. Highest temperature of strain clamp underdifferent contact resistances for different parts
接触
面积比引流板
压接处线夹本体
压接处引流板
接触面所有
接触面10 000 74.07 74.07 74.07 74.07 20 000 82.02 75.11 94.52 98.27 40 000 94.53 81.03 130.96 138.84 100 000 128.35 97.21 218.88 239.91 
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表 2 实验测量电阻与仿真设置电阻对比
Table 2. Comparison of experimental resistance andsimulation resistance
项目 螺栓力矩
（N•m）接触面
积比总电阻/
μΩ引流板
电阻/μΩ实验 20 68.9 36.1 仿真 5 000 66.4 35.5 误差/% 3.7 1.6 实验 40 61.7 28.9 仿真 4 200 60.1 29.3 误差/% 2.6 1.5 实验 60 58.3 25.5 仿真 3 000 56.0 25.2 误差/% 4.0 1.2
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表 3 仿真结果与试验各点温度对比
Table 3. Comparison between simulation results and experimental temperatures
力矩 结果 测温点 测温点 测温点 测温点 20 试验 64.3 71.3 70.5 69.4 仿真 65.1 68.9 69.8 70.7 误差/% 1.2 3.4 1.0 1.9 40 试验/% 65.1 66.6 66.3 66.9 仿真 63.9 66.2 65.2 68.2 误差/% 1.9 0.6 1.7 1.9 60 试验 64.5 63.5 61.3 64.4 仿真 62.4 62.9 62.8 67.2 误差/% 3.3 0.9 2.4 4.3
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