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架空线路耐张线夹三维温度场仿真分析及验证

董选昌 曲烽瑞 李艳飞 王亦清

董选昌, 曲烽瑞, 李艳飞, 王亦清. 架空线路耐张线夹三维温度场仿真分析及验证[J]. 西南交通大学学报, 2019, 54(5): 997-1004. doi: 10.3969/j.issn.0258-2724.20180610
引用本文: 董选昌, 曲烽瑞, 李艳飞, 王亦清. 架空线路耐张线夹三维温度场仿真分析及验证[J]. 西南交通大学学报, 2019, 54(5): 997-1004. doi: 10.3969/j.issn.0258-2724.20180610
DONG Xuanchang, QU Fengrui, LI Yanfei, WANG Yiqing. Simulation Analysis and Verification on Three-Dimensional Temperature Field of Strain Clamps for Overhead Lines[J]. Journal of Southwest Jiaotong University, 2019, 54(5): 997-1004. doi: 10.3969/j.issn.0258-2724.20180610
Citation: DONG Xuanchang, QU Fengrui, LI Yanfei, WANG Yiqing. Simulation Analysis and Verification on Three-Dimensional Temperature Field of Strain Clamps for Overhead Lines[J]. Journal of Southwest Jiaotong University, 2019, 54(5): 997-1004. doi: 10.3969/j.issn.0258-2724.20180610

架空线路耐张线夹三维温度场仿真分析及验证

doi: 10.3969/j.issn.0258-2724.20180610
详细信息
    作者简介:

    董选昌(1971—),男,高级工程师,研究方向为输电线路运行管理, E-mail:dongxcdx@163.com

  • 中图分类号: TM244.1

Simulation Analysis and Verification on Three-Dimensional Temperature Field of Strain Clamps for Overhead Lines

  • 摘要: 为研究不同条件下架空线路耐张线夹温度分布情况,构建了基于耐张线夹简化结构的有限元模型,并在600 A工频交流电流和不同接触电阻比的条件下,进行了耐张线夹电磁-热耦合有限元仿真,最终得到耐张线夹的三维温度场分布. 仿真结果显示:在正常情况下,耐张线夹引流板处的温度最低;在线夹不同部位接触电阻增大的情况下,引流板处接触电阻的增大对线夹整体温度升高的影响最大,而线夹本体压接处接触电阻的增大对线夹温升影响最小,同时线夹温度升高也会制约架空线路导线载流量. 最后通过线夹电阻测量试验和温升试验验证仿真的准确性,误差约为2.3%.

     

  • 图 1  NY300/40型线夹简化模型结构

    Figure 1.  Simplified model structure for the NY300/40 strain clamp

    图 2  电磁-热耦合模型求解迭代流程

    Figure 2.  Iteration process for electromagnetic-thermal coupling model

    图 3  所有接触面积比为1 000时温度分布

    Figure 3.  Temperature distribution with the contact area ratio of 1 000

    图 4  线夹本体压接处接触面积比为100 000时温度分布

    Figure 4.  Temperature distribution when the contact area ratio of crimp connection at the clamp body is 100 000

    图 5  引流板接触面积比为100 000时温度分布

    Figure 5.  Temperature distribution when the contact area ratio of the conductive plate is 100 000

    图 6  引流板压接处接触面积比为100 000时温度分布

    Figure 6.  Temperature distribution when the contact area ratio of crimp connection at the conductive plate is 100 000

    图 7  耐张线夹温升实验装置

    Figure 7.  Setup for the temperature rise test of strain clamp

    图 8  测温点布置

    Figure 8.  Layout of temperature measurement points

    图 9  引流板接触面积比为5 000,压接部位接触面积比为1 000时的温度分布

    Figure 9.  Temperature distribution when the contact area ratio of the conductive plate is 5 000 and the contact area ratio of crimp connection is 1 000

    表  1  不同部位接触情况恶化下耐张线夹的最高温度

    Table  1.   Highest temperature of strain clamp underdifferent contact resistances for different parts

    接触
    面积比
    引流板
    压接处
    线夹本体
    压接处
    引流板
    接触面
    所有
    接触面
    10 000 74.07 74.07 74.07 74.07
    20 000 82.02 75.11 94.52 98.27
    40 000 94.53 81.03 130.96 138.84
    100 000 128.35 97.21 218.88 239.91
    下载: 导出CSV

    表  2  实验测量电阻与仿真设置电阻对比

    Table  2.   Comparison of experimental resistance andsimulation resistance

    项目螺栓力矩
    (N•m)
    接触面
    积比
    总电阻/
    μΩ
    引流板
    电阻/μΩ
    实验 20 68.9 36.1
    仿真 5 000 66.4 35.5
    误差/% 3.7 1.6
    实验 40 61.7 28.9
    仿真 4 200 60.1 29.3
    误差/% 2.6 1.5
    实验 60 58.3 25.5
    仿真 3 000 56.0 25.2
    误差/% 4.0 1.2
    下载: 导出CSV

    表  3  仿真结果与试验各点温度对比

    Table  3.   Comparison between simulation results and experimental temperatures

    力矩结果测温点测温点测温点测温点
    20试验64.371.370.569.4
    仿真65.168.969.870.7
    误差/%1.23.41.01.9
    40试验/%65.166.666.366.9
    仿真63.966.265.268.2
    误差/%1.90.61.71.9
    60试验64.563.561.364.4
    仿真62.462.962.867.2
    误差/%3.30.92.44.3
    下载: 导出CSV
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出版历程
  • 收稿日期:  2018-07-19
  • 修回日期:  2018-09-30
  • 网络出版日期:  2018-10-31
  • 刊出日期:  2019-10-01

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