三乙醇胺含量对化学浴法制备硫化铜薄膜的影响

范希梅; 张冯章; 李湘奇; 邬小凤; 范健; 黄瑶翰; 李广立

doi:10.3969/j.issn.0258-2724.2015.04.019

三乙醇胺含量对化学浴法制备硫化铜薄膜的影响

doi: 10.3969/j.issn.0258-2724.2015.04.019

范希梅^1,2,
张冯章^1,2,
李湘奇^1,2,
邬小凤^1,2,
范健^1,2,
黄瑶翰^1,2,
李广立^1,2

基金项目:

国家863计划资助项目(2009AA03Z427)

详细信息

作者简介:
范希梅(1970-),女,教授,博士,研究方向为纳米功能材料及应用、材料表面改性和复合材料,E-mail:xmfan@home.swjtu.edu.cn

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出版历程
- 收稿日期: 2014-04-30
- 刊出日期: 2015-08-25

Influence of Triethanolamine Content on CuS Thin Films Prepared by Chemical Bath Deposition

摘要

摘要: 为了研究三乙醇胺(TEA)在化学水域沉积法工艺中的作用,本文以氯化铜, 硫脲, 氨水和三乙醇胺为原料, 采用化学浴沉积法在玻璃基底表面成功制备了硫化铜薄膜. 研究了三乙醇胺不同含量对薄膜的厚度、结构,、形貌和光学性能的影响, 并分析了反应机理. 研究结果表明:三乙醇胺在反应中起到络合剂的作用,随着三乙醇胺含量的增加, 反应诱导时间延长到23 min; 沉积时间相同的情况下,组成薄膜的颗粒粒径变大且薄膜增厚240 nm, 同时透射率呈现出减小的趋势.
- 硫化铜薄膜 /
- 化学浴沉积法 /
- 三乙醇胺 /
- 络合剂
Abstract: In order to study the effect of triethanolamine (TEA) on chemical bath deposition process, CuS thin films were successfully deposited onto glass substrates by chemical bath deposition using copper chloride, thiourea, ammonium and TEA as raw materials. The effects of TEA content on thickness, structure, morphology and optical properties of the obtained films and the deposition mechanism were investigated. The results showed that the TEA could act as a complexing agent to maintain the reaction stability. As the TEA content increased, the induction time of reaction increased to 23 min, the films exhibited bigger particles sizes after the same deposition time, and the film thickness increased to 240 nm. In addition, the transmittance of the films decreased with TEA increasing.
- CuS thin films /
- chemical bath deposition /
- triethanolamine /
- complexing agent

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