树脂基复合材料修补片固化过程中的温度场

陈淑仙; 王渊涛; 杨文锋; 李梦; 秦文峰; 唐庆如

doi:10.3969/j.issn.0258-2724.2014.05.020

树脂基复合材料修补片固化过程中的温度场

doi: 10.3969/j.issn.0258-2724.2014.05.020

基金项目:

国家自然科学基金民航联合基金重点资助项目（U1233202，U1333201）

国家自然科学基金资助项目（51306201）

江苏省航空动力系统重点实验室开放课题资助项目（APS-2013-04）

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出版历程
- 收稿日期: 2014-05-27
- 刊出日期: 2014-10-25

Analysis of Temperature Field of Resin Matrix Composite Patches during Curing Process

摘要

摘要: 为优化树脂基复合材料修补片固化工艺参数，采用有限元分析方法，建立了复合材料层合板修补片热固化过程的物理模型和数学模型，基于这些模型对复合材料预浸料修补片固化过程中温度和固化度的变化规律进行了数值模拟，分析了不同固化阶段预浸料修补片内部的温度分布，对比了修补片内部不同点的固化过程；研究了升温速率、补片厚度和补片形状等因素对补片固化过程中温度和固化度的影响.仿真计算结果表明：升温速率越快，固化完成时间越短，但修补片内温度梯度越大；补片越厚，固化完成时间越短，且补片内部温度梯度越小；非穿透性挖补修理的补片形状对补片固化过程中温度和固化度的影响可忽略.
- 有限单元法 /
- 复合材料 /
- 修补片 /
- 固化过程 /
- 温度
Abstract: In order to optimize the curing parameter of resin matrix composite patches, a physical model and a mathematical model for composite laminate patches during thermal curing process were established by finite element method. Based on these models, numerical simulations were made to study the variation rules of temperature and curing degree during the curing process of the composite prepreg patches. The internal temperature distributions in prepreg repair patches were analyzed for different curing stages, and the curing processes at different points inside the patches were compared. The influences of heating rate, the patch thickness, and patch shape on the temperature and curing degree during curing process were also studied. The simulation results show that a faster heating rate can shorten the time for completing the curing process, and result in a higher temperature gradient within the patch; a more thick patch needs a shorter curing time and has a lower internal temperature gradient; and, the effect of the patch shape on the temperature and curing degree can be ignored for the non-penetrating repair.
- finite element method /
- composite /
- patch /
- curing process /
- temperature

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参考文献(15)

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文章访问数: 992
HTML全文浏览量: 83
PDF下载量: 424
被引次数: 0

树脂基复合材料修补片固化过程中的温度场

doi: 10.3969/j.issn.0258-2724.2014.05.020

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出版历程

Analysis of Temperature Field of Resin Matrix Composite Patches during Curing Process

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出版历程

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