| Citation: | YAN Lianshan, XIE Xiaojun, CHEN Jianping, ZHOU Linjie, PEI Li, YAN Fengping, YUE Yang, YE Jia, DENG Xiong, ZOU Xihua, PAN Wei, ZHU Ninghua. Multiplex Integration of Photonics & Electronics and Applications in Communication & Sensing[J]. Journal of Southwest Jiaotong University, 2026, 61(3): 806-832. doi: 10.3969/j.issn.0258-2724.20260117 |
Driven by the rapid advancement of broadband communications, artificial intelligence, and satellite internet, global data traffic is growing exponentially, while conventional electronic integration is approaching physical limits in bandwidth, power consumption, and latency. Photonics-electronics multiplex integration, leveraging multi-dimensional synergy across the full hierarchy from materials and devices to chips and systems, transcends the bandwidth and power constraints of all-electronic architectures and is emerging as a key enabling technology for next-generation information systems. A systematic review of recent advances in photonics-electronics multiplex integration was presented. Its conceptual framework and developmental trends were first delineated, followed by a survey of high-fidelity simulation technologies that bridge link-level systems and chip-scale implementations, with particular emphasis on the state of the art in heterogeneous integration processes, core devices, and system-on-chip architectures. Representative applications in high-speed communications and intelligent sensing were subsequently examined, followed by a forward-looking discussion of future trajectories toward space, air, and ground integrated networks and AI computing clusters. Three grand challenges that must be addressed were further identified, namely the limits of multi-physics coupling, cross-scale manufacturing consistency, and intelligent adaptive control, and a phased breakthrough roadmap was proposed. These offer strategic insights for ubiquitous 6G coverage and the sustainable evolution of computing networks.
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