• ISSN 0258-2724
  • CN 51-1277/U
  • EI Compendex
  • Scopus
  • Indexed by Core Journals of China, Chinese S&T Journal Citation Reports
  • Chinese S&T Journal Citation Reports
  • Chinese Science Citation Database
Volume 30 Issue 2
Apr.  2017
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Article Contents
ZHOU Xiuyun, XUE Yun, ZHOU Jinlong. Defect Detection of Solder Balls Based on Multi-Physical Field[J]. Journal of Southwest Jiaotong University, 2017, 30(2): 363-368. doi: 10.3969/j.issn.0258-2724.2017.02.021
Citation: ZHOU Xiuyun, XUE Yun, ZHOU Jinlong. Defect Detection of Solder Balls Based on Multi-Physical Field[J]. Journal of Southwest Jiaotong University, 2017, 30(2): 363-368. doi: 10.3969/j.issn.0258-2724.2017.02.021

Defect Detection of Solder Balls Based on Multi-Physical Field

doi: 10.3969/j.issn.0258-2724.2017.02.021
  • Received Date: 05 May 2015
  • Publish Date: 25 Apr 2017
  • A pulsed eddy current thermal imaging method that is based on a coupled electric, magnetic, and thermal physical field was proposed for defect detection of solder balls in the production and service process of flip chips. In this method, an electromagnetic-thermal model for solder balls was established using the finite element software COMSOL. Through this model, temperature distributions on the top surface of solder balls were extracted to analyze their thermal conduction properties and identify their defects (i.e., voids and cracks). The effects of defect size (crack length or width and void radius) on the temperature distribution were discussed for quantitative analysis of solder ball defects. Simulation results show that at the end of heating, the solder ball with a crack of length 200 m and height 20 m has a higher surface temperature than the normal solder ball, while the solder ball with a void of diameter 150 m has a lower surface temperature. The surface temperature rises when there exists a crack close to the top surface of the ball, but increases linearly for voided solder balls when the void radius increases from 35 to 75 m. Therefore, solder balls with different defects can be identified according to their surface temperature distribution.

     

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