• ISSN 0258-2724
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Volume 27 Issue 5
Oct.  2014
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Article Contents
Journal of Southwest Jiaotong University  > 2014  >  27(5): 869-874.
CHEN Shuxian, WANG Yuantao, YANG Wenfeng, LI Meng, QIN Wenfeng, TANG Qingru. Analysis of Temperature Field of Resin Matrix Composite Patches during Curing Process[J]. Journal of Southwest Jiaotong University, 2014, 27(5): 869-874. doi: 10.3969/j.issn.0258-2724.2014.05.020
Citation: CHEN Shuxian, WANG Yuantao, YANG Wenfeng, LI Meng, QIN Wenfeng, TANG Qingru. Analysis of Temperature Field of Resin Matrix Composite Patches during Curing Process[J]. Journal of Southwest Jiaotong University, 2014, 27(5): 869-874. doi: 10.3969/j.issn.0258-2724.2014.05.020
shu

Analysis of Temperature Field of Resin Matrix Composite Patches during Curing Process

doi: 10.3969/j.issn.0258-2724.2014.05.020
  • Received Date: 27 May 2014
  • Publish Date: 25 Oct 2014
    Abstract
  • In order to optimize the curing parameter of resin matrix composite patches, a physical model and a mathematical model for composite laminate patches during thermal curing process were established by finite element method. Based on these models, numerical simulations were made to study the variation rules of temperature and curing degree during the curing process of the composite prepreg patches. The internal temperature distributions in prepreg repair patches were analyzed for different curing stages, and the curing processes at different points inside the patches were compared. The influences of heating rate, the patch thickness, and patch shape on the temperature and curing degree during curing process were also studied. The simulation results show that a faster heating rate can shorten the time for completing the curing process, and result in a higher temperature gradient within the patch; a more thick patch needs a shorter curing time and has a lower internal temperature gradient; and, the effect of the patch shape on the temperature and curing degree can be ignored for the non-penetrating repair.

     

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